

AMD is set to launch its new 800-series AM5 motherboards alongside the Ryzen 9000 "Zen 5" Desktop CPUs, skipping the 700-series entirely. This move aligns AMD's naming convention with Intel's, as both will now feature 800 series chipsets. The upcoming motherboards, including the B650E AORUS PRO X USB4 from GIGABYTE, will showcase new features like USB4 support and are expected to be unveiled at Computex 2024.

AMD's Ryzen desktop CPU generations have seen significant advancements in technology and capability from the Ryzen 1000 series through to the Ryzen 9000 series.
Ryzen 1000 Series (Summit Ridge): Launched in 2017, this was AMD's first generation of Ryzen CPUs, utilizing a 14nm process. It supported up to 8 cores and 16 threads, with a maximum TDP (Thermal Design Power) of 95W. These processors were compatible with the AM4 platform and 300-Series chipsets, supporting DDR4-2677 memory and PCIe Gen 3.0.
Ryzen 2000 Series (Pinnacle Ridge): Introduced in 2018, this generation improved upon the first by using a 12nm process and supporting faster DDR4-2933 memory. The core and thread counts remained the same, but the max TDP was slightly increased to 105W.
Ryzen 3000 Series (Matisse): In 2019, AMD moved to a 7nm process technology with the Ryzen 3000 series, doubling the maximum cores and threads to 16/32. This series also introduced support for PCIe Gen 4.0 and increased memory support to DDR4-3200.
Ryzen 5000 Series (Vermeer): Continuing with the 7nm process, the Ryzen 5000 series, launched in 2020, maintained the same core and thread counts and TDP as the Ryzen 3000 series but stayed on the AM4 platform with 500-series chipsets12.
Ryzen 5000 3D Series: An iteration on the Ryzen 5000, this series introduced AMD's 3D V-Cache technology, enhancing gaming and processing performance.
Ryzen 7000 Series (Raphael): This 2022 series marked a significant leap with a shift to a 5nm process and the introduction of the AM5 platform. It supported DDR5-5200 memory and PCIe Gen 5.0, offering substantial improvements in speed and efficiency with a max TDP of 170W.
Ryzen 7000 3D Series: Similar to the non-3D series but with a lower TDP of 120W, continuing to leverage the benefits of 3D V-Cache technology.
Ryzen 9000 Series (Granite Ridge): Slated for a 2024 release, this series promises further enhancements by moving to a 3nm process technology. It supports DDR5-5600+ memory and continues to use PCIe Gen 5.0, expected to deliver even higher efficiency and performance capabilities.
Each generation has built upon the last, with improvements in manufacturing processes, energy efficiency, memory support, and data transfer capabilities, reflecting AMD's commitment to innovation in its CPU technologies.

AMD's 800-series AM5 motherboards are expected to introduce several new features for Ryzen PCs3. These features include more durable memory bodies, a dedicated Sensor Panel Link to connect external displays for monitoring, and a high-quality "PCIe EZ-Latch Plus" PCIe slot. These motherboards will also support the upcoming Ryzen 9000 series "Zen 5" desktop CPUs and are expected to be unveiled at Computex 2024.