Siemens Brings Advanced Multiphysics And AI To Chip Design
What advancements has Siemens made in EDA tools?
Siemens has made advancements in EDA tools by introducing the Solido Simulation Suite for mixed-signal and custom chip designs, enhancing the Calibre design verification platform with multiphysics simulation for 3D IC thermal analysis, and optimizing tools to work in the cloud for greater flexibility and resources. These advancements improve accuracy, speed, and efficiency in IC design and verification.
How does SPICE simulation benefit IC design?
SPICE simulation benefits IC design by enabling engineers to model and analyze the behavior of electronic circuits before they are physically constructed1. This helps detect potential issues in design before the PCB is fabricated, saving time, cost, and resources. SPICE simulators can analyze complex behaviors of a circuit, including DC, AC, and transient analyses, and provide detailed insights into the electrical properties of the circuit.
What are the main features of the Solido Simulation Suite?
The Solido Simulation Suite is an integrated suite of AI-accelerated SPICE, Fast SPICE, and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for next-generation analog, mixed-signal, and custom IC designs25. The suite includes three new simulators: Solido SPICE, Solido FastSPICE, and Solido LibSPICE, as well as Siemens' market-proven AFS platform, ELDO software, and Symphony software. The suite is built on the foundation of Siemens' industry-proven, foundry-certified Analog FastSPICE (AFS) platform.